The "Science" magazine published on April 17 published a special review paper, expounding the research results of using nano-scale coherent interface strengthening materials. The results were completed by Lu Ke and Lu Lei, researchers at the National (Joint) Laboratory of Materials Science in Shenyang Institute of Metals, Chinese Academy of Sciences, and S. Suresh, a professor at the Massachusetts Institute of Technology. Lu Ke et al. proposed a new material strengthening principle and approacha€”using nano-scale coherent interface to strengthen materials.
Improving material strength is a core issue in materials research for a long time. Material strengthening is often accompanied by a sharp drop in plasticity or toughness, while high plastic toughness materials tend to be very low in strength. For a long time, the a€?inversion relationshipa€? of the toughness of this material has become a bottleneck restricting the development of materials.
Lu Ke et al. found that the nanoscale twin interface has three basic structural features of the above-mentioned enhanced interface. They used pulse electroplating technology to successfully prepare a high-density nano-scale twin structure in pure copper samples. It was found that the strength and tensile plasticity of the sample increased significantly as the thickness of the twin layer decreased. When the thickness of the layer is 15 nm, the tensile yield strength is close to 1 GPa, which is more than 10 times that of ordinary coarse copper, and the uniform elongation of stretching is up to 13%. Theoretical analysis and molecular dynamics simulations show that the ultra-high strength and high plasticity exhibited by high-density twin materials are derived from the unique interaction of nano-scale twin boundaries and dislocations.
In addition, the dynamic plastic deformation technology recently developed by Lu Ke et al. can form a large number of nano-scale twin boundaries in materials, which has become an effective way to prepare bulk nano-twisted structures. Although there are still many challenges in the preparation technology, control growth, and various physical and chemical properties, mechanical properties and exploratory behavior of nanoscale coherent interfaces, this new enhancement approach has shown great performance in improving the comprehensive performance of engineering materials. Development potential and broad application prospects.
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